型號 |
品牌 | 封裝 | 批號 | 查看 | |
---|---|---|---|---|---|
LM385BDE4-2-5 | TI | 8-SOIC | New | 詳細(xì) | |
SN74AUC1G02YEPR | TI | 5-DSBGA, 5-WCSP (1.4x0.9) | New | 詳細(xì) | |
AM3894CCYGA120 | TI | 1031-FCBGA (25x25) | New | 詳細(xì) | |
LAUNCHXL-F28027 | TI | New | 詳細(xì) | ||
DS90LV027ATM/NOPB | TI | 8-SOIC | New | 詳細(xì) | |
SN74AHC16540DLRG4 | TI | 48-SSOP | New | 詳細(xì) | |
UC3823BN | TI | 16-PDIP | New | 詳細(xì) | |
BQ4015MA-85 | TI | 32-DIP Module (18.42x42.8) | New | 詳細(xì) | |
TPS62800EVM-892 | TI | New | 詳細(xì) | ||
AMC1306EVM | TI | New | 詳細(xì) | ||
TS5A3153DCUR | TI | US8 | New | 詳細(xì) | |
MSP430FR4133IPMR | TI | 64-LQFP (10x10) | New | 詳細(xì) | |
PCM1744U/2K | TI | 14-SOIC | New | 詳細(xì) | |
DAC0832LCWMX | TI | 20-SOIC | New | 詳細(xì) | |
LP3963ESX-2.5/NOPB | TI | DDPAK/TO-263-5 | New | 詳細(xì) | |
LP3875ESX-3.3 | TI | DDPAK/TO-263-5 | New | 詳細(xì) | |
LM25010SDX | TI | 10-WSON (4x4) | New | 詳細(xì) | |
TLC2262CP | TI | 8-PDIP | New | 詳細(xì) | |
LM3503SQX-16 | TI | 16-WQFN (4x4) | New | 詳細(xì) | |
TPS715A01DRVT | TI | 6-SON (2x2) | New | 詳細(xì) |