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  • MSP430F4270IRGZT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MSP430x4xx
    Part Status : Active
    Core Processor : MSP430
    Core Size : 16-Bit
    Speed : 8MHz
    Peripherals : Brown-out Detect/Reset, LCD, POR, PWM, WDT
    Number of I/O : 32
    Program Memory Size : 32KB (32K x 8 + 256B)
    Program Memory Type : FLASH
    RAM Size : 256 x 8
    Voltage - Supply (Vcc/Vdd) : 1.8V ~ 3.6V
    Data Converters : A/D 1x16b; D/A 1x12b
    Oscillator Type : Internal
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 48-VFQFN Exposed Pad
    Supplier Device Package : 48-VQFN (7x7)

極速報(bào)價(jià)

型號
 品牌 封裝 批號 查看
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SM72480X/NOPB TI 6-WSON (2.2x2.5) New 詳細(xì)
CDCLVP111RHBT TI 32-VQFN (5x5) New 詳細(xì)
PCM1870RHFR TI 24-VQFN (5x4) New 詳細(xì)
TS3A27518EIRTWRQ1 TI 24-WQFN (4x4) New 詳細(xì)
TRSF3232IPWG4 TI 16-TSSOP New 詳細(xì)
SN74AHC1G02DBVT TI SOT-23-5 New 詳細(xì)
SN75HVD07D TI 8-SOIC New 詳細(xì)
SN74AHCT16373DGGR TI 48-TSSOP New 詳細(xì)
MM5452V TI 44-PLCC (16.58x16.58) New 詳細(xì)
SN74AHC174NSR TI New 詳細(xì)
TPA3130D2DAP TI 32-HTSSOP New 詳細(xì)
DS25MB200TSQ TI 48-WQFN (7x7) New 詳細(xì)
LM48901RL/NOPB TI 36-DSBGA (3.5x3.24) New 詳細(xì)
OPA552FAKTWTG3 TI DDPAK/TO-263-7 New 詳細(xì)
LM2598S-5.0 TI DDPAK/TO-263-7 New 詳細(xì)
TAS5036BPFC TI 80-TQFP (12x12) New 詳細(xì)
CDC421250RGERG4 TI 24-VQFN (4x4) New 詳細(xì)