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羅斌森

  • XCZU6EG-L1FFVC900I

  • Manufacturer : Xilinx Inc.
    Packaging : Tray
    Series : Zynq? UltraScale+? MPSoC EG
    Part Status : Active
    Architecture : MCU, FPGA
    Core Processor : Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
    RAM Size : 256KB
    Peripherals : DMA, WDT
    Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Speed : 500MHz, 600MHz, 1.2GHz
    Primary Attributes : Zynq?UltraScale+? FPGA, 469K+ Logic Cells
    Operating Temperature : -40°C ~ 100°C (TJ)
    Package / Case : 900-BBGA, FCBGA
    Supplier Device Package : 900-FCBGA (31x31)

極速報價

型號
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