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羅斌森

  • XC7Z045-2FBG676CES

  • Manufacturer : Xilinx Inc.
    Packaging : Tray
    Series : Zynq?-7000
    Part Status : Obsolete
    Architecture : MCU, FPGA
    Core Processor : Dual ARM? Cortex?-A9 MPCore? with CoreSight?
    RAM Size : 256KB
    Peripherals : DMA
    Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Speed : 800MHz
    Primary Attributes : Kintex?-7 FPGA, 350K Logic Cells
    Operating Temperature : 0°C ~ 85°C (TJ)
    Package / Case : 676-BBGA, FCBGA
    Supplier Device Package : 676-FCBGA (27x27)

極速報價

型號
 品牌 封裝 批號 查看
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XC7Z030-3FBG484E Xilinx 484-FCBGA (23x23) New 詳細(xì)
XA6SLX45-2CSG484Q Xilinx 484-CSPBGA (19x19) New 詳細(xì)
XCV200-4BG256C Xilinx 256-PBGA (27x27) New 詳細(xì)
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XC5VLX85-2FFG1153C Xilinx 1153-FCBGA (35x35) New 詳細(xì)
XC4VSX35-11FFG668C Xilinx 668-FCBGA (27x27) New 詳細(xì)
XC4005E-2PQ208C Xilinx 208-PQFP (28x28) New 詳細(xì)
XC2VP40-6FFG1152I Xilinx 1152-FCBGA (35x35) New 詳細(xì)
XC4VLX80-10FF1148C Xilinx 1148-FCPBGA (35x35) New 詳細(xì)
XC5VLX50T-2FFG665I Xilinx 665-FCBGA (27x27) New 詳細(xì)
XCS30-3BG256C Xilinx 256-PBGA (27x27) New 詳細(xì)
XC7K325T-2FF676I Xilinx 676-FCBGA (27x27) New 詳細(xì)
XC2V250-4FGG456C Xilinx 456-FBGA (23x23) New 詳細(xì)
XC17S20VO8C Xilinx 8-TSOP New 詳細(xì)