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羅斌森

  • XC7Z030-2FBG676I

  • Manufacturer : Xilinx Inc.
    Packaging : Tray
    Series : Zynq?-7000
    Part Status : Active
    Architecture : MCU, FPGA
    Core Processor : Dual ARM? Cortex?-A9 MPCore? with CoreSight?
    RAM Size : 256KB
    Peripherals : DMA
    Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Speed : 800MHz
    Primary Attributes : Kintex?-7 FPGA, 125K Logic Cells
    Operating Temperature : -40°C ~ 100°C (TJ)
    Package / Case : 676-BBGA, FCBGA
    Supplier Device Package : 676-FCBGA (27x27)

極速報價

型號
 品牌 封裝 批號 查看
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XC2S50E-6TQ144C Xilinx 144-TQFP (20x20) New 詳細
XC6SLX75-N3FG484C Xilinx 484-FBGA (23x23) New 詳細
XC2VP40-5FG676I Xilinx 676-FCBGA (27x27) New 詳細
XC6SLX4-2TQG144I Xilinx 144-TQFP (20x20) New 詳細
XC6VHX380T-1FFG1154I Xilinx 1156-FCBGA (35x35) New 詳細
XC7K160T-1FF676I Xilinx 676-FCBGA (27x27) New 詳細
EFR-DI-10GEMAC-SITE Xilinx New 詳細
XC7S100-1FGGA484I Xilinx 484-FCBGA (23x23) New 詳細
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XC17S30XLVOG8C Xilinx 8-TSOP New 詳細
XC4005XL-1TQ144C Xilinx 144-TQFP (20x20) New 詳細
XC7S50-L1CSGA324I Xilinx 324-FPGA (15x15) New 詳細
XC2VP20-7FFG896C Xilinx 896-FCBGA (31x31) New 詳細
XC2V6000-4FF1517I Xilinx 1517-FCBGA (40x40) New 詳細