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羅斌森

  • XC7Z030-1FBG676I

  • Manufacturer : Xilinx Inc.
    Packaging : Tray
    Series : Zynq?-7000
    Part Status : Active
    Architecture : MCU, FPGA
    Core Processor : Dual ARM? Cortex?-A9 MPCore? with CoreSight?
    RAM Size : 256KB
    Peripherals : DMA
    Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Speed : 667MHz
    Primary Attributes : Kintex?-7 FPGA, 125K Logic Cells
    Operating Temperature : -40°C ~ 100°C (TJ)
    Package / Case : 676-BBGA, FCBGA
    Supplier Device Package : 676-FCBGA (27x27)

極速報價

型號
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