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  • XC7Z007S-2CLG225E

  • Manufacturer : Xilinx Inc.
    Packaging : Tray
    Series : Zynq?-7000
    Part Status : Active
    Architecture : MCU, FPGA
    Core Processor : Single ARM? Cortex?-A9 MPCore? with CoreSight?
    RAM Size : 256KB
    Peripherals : DMA
    Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Speed : 766MHz
    Primary Attributes : Artix?-7 FPGA, 23K Logic Cells
    Operating Temperature : 0°C ~ 100°C (TJ)
    Package / Case : 225-LFBGA, CSPBGA
    Supplier Device Package : 225-CSPBGA (13x13)

極速報(bào)價(jià)

型號(hào)
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XC6SLX9-2CSG324C Xilinx 324-CSPBGA (15x15) New 詳細(xì)
XC7A50T-2FGG484I Xilinx 484-FBGA (23x23) New 詳細(xì)
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