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羅斌森

  • FIN1101MX

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Type : Buffer, ReDriver
    Applications : LVDS
    Input : LVDS, LVPECL
    Output : LVDS
    Data Rate (Max) : 1.6Gbps
    Number of Channels : 1
    Delay Time : 1.1ns
    Capacitance - Input : 2.2pF
    Voltage - Supply : 3V ~ 3.6V
    Current - Supply : 9.3mA
    Operating Temperature : -40°C ~ 85°C
    Mounting Type : Surface Mount
    Package / Case : 8-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 8-SOIC

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