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羅斌森

  • MAX31730AUB+

  • Manufacturer : Maxim Integrated
    Packaging : Tube
    Alternate Packaging
    Part Status : Active
    Applications : ASIC, CPU, FPGA Die Temp Monitoring
    Interface : 2-Wire
    Voltage - Supply : 3V ~ 3.6V
    Package / Case : 10-TFSOP, 10-MSOP (0.118", 3.00mm Width)
    Supplier Device Package : 10-uMAX
    Mounting Type : Surface Mount

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