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羅斌森

  • FES10D

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

極速報價

型號
 品牌 封裝 批號 查看
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NCP3066SCBSTGEVB ON New 詳細
74OL60113S ON 6-SMD New 詳細
74AC05SCX ON 14-SOIC New 詳細
NUF2441FCT1G ON New 詳細
KSH112TF ON D-Pak New 詳細
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MC100EP16TDR2 ON 8-SOIC New 詳細
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NTTS2P03R2G ON Micro8? New 詳細
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HLMP6800A ON Subminiature T-3/4 New 詳細
CAT5221WI00 ON New 詳細
NVMD3P03R2G ON 8-SOIC New 詳細
CM1213-06MR ON 8-MSOP New 詳細
NCP729FC33T2G ON 4-CSP (1.06x1.06) New 詳細